JPH01160868U - - Google Patents
Info
- Publication number
- JPH01160868U JPH01160868U JP1988048273U JP4827388U JPH01160868U JP H01160868 U JPH01160868 U JP H01160868U JP 1988048273 U JP1988048273 U JP 1988048273U JP 4827388 U JP4827388 U JP 4827388U JP H01160868 U JPH01160868 U JP H01160868U
- Authority
- JP
- Japan
- Prior art keywords
- etching resist
- filled
- recessed part
- filling table
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims description 17
- 238000009499 grossing Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988048273U JPH01160868U (en]) | 1988-04-12 | 1988-04-12 | |
| US07/332,608 US4980219A (en) | 1988-04-06 | 1989-03-31 | Carrier tape for bonding IC devices and method of using the same |
| KR1019890004474A KR920005451B1 (ko) | 1988-04-06 | 1989-04-04 | Ic 데바이스를 본딩하기 위한 캐리어 테이프 및 그 사용 방법 |
| US07/580,262 US5019209A (en) | 1988-04-06 | 1990-09-10 | Method of manufacturing and using a carrier tape for bonding IC devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988048273U JPH01160868U (en]) | 1988-04-12 | 1988-04-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160868U true JPH01160868U (en]) | 1989-11-08 |
Family
ID=31274432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988048273U Pending JPH01160868U (en]) | 1988-04-06 | 1988-04-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160868U (en]) |
-
1988
- 1988-04-12 JP JP1988048273U patent/JPH01160868U/ja active Pending